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Ataru resin bottles with printed parts
High-performance resin

Ataru High-Temp DLP Resin

A UV-curable resin engineered for the hard cases: heat resistance beyond 300°C, high tensile strength, and low dielectric loss. Compatible with all resin printers (SLA / DLP / LCD / MSLA). Ideal for high-temperature tooling, molds, RF components and additively manufactured electronics.

$693.00
1 L and 5 L volume pricing. 5 L ships in one container.

This shop ships to North and South American customers only. If you're outside this region, please Get a quote and we'll provide a separate quote.

↓ Download data sheet (PDF)
300°C+ heat resistanceLow dielectric lossExcellent surface quality High tensile strengthAll resin printersLow viscosityPost-cure ready
Material
UV-curable photopolymer resin
Process
All resin printers (SLA / DLP / LCD / MSLA)
Heat resistance
Beyond 300°C
Mechanical
High tensile strength & robust resilience
Electrical
Low dielectric loss, strong for RF / high-frequency
Finish
Excellent surface quality, even on entry-level resin printers
Viscosity
Low, for broad resin-printer compatibility
Best for
High-temp tooling & molds, RF/antenna parts, AME, aerospace
Printed on

Compatible printers

Ataru runs on all resin printers (SLA / DLP / LCD / MSLA), including platforms from:

Axtra
Formlabs
Elegoo
Prusa
B9C
Stratasys
Technical specifications

Tested performance

Measured on cured resin samples. Values are indicative for Ataru high-temp resin.

Heat deflection temperature
300°C+
ISO 75
Tensile strength
65 MPa
ASTM D638
Tensile modulus
2.7 GPa
ASTM D638
Elongation at break
5%
ASTM D638
Flexural strength
80 MPa
ISO 178
Dielectric constant
~3.1
@1 MHz

Best for high-temp tooling, RF components, mold inserts, and functional prototypes where heat resistance, electrical stability, and surface finish matter. Not recommended for long-term hydrocarbon exposure.

Working on electronics or RF?

Ataru pairs with our AME and high-temp tooling production. Let's talk.

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